Don Clark / New York Times:

The Biden administration plans to direct up to $1.6B in CHIPS Act funding towards R&D to accelerate domestic capacity for advanced chip packaging  —  The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia.

Don Clark / New York Times:

The Biden administration plans to direct up to $1.6B in CHIPS Act funding towards R&D to accelerate domestic capacity for advanced chip packaging  —  The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia.

Source: TechMeme
Source Link: http://www.techmeme.com/240709/p27#a240709p27