Reuters:

TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun  —  Taiwan Semiconductor Manufacturing Co (2330.TW) plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters.

Reuters:

TSMC SVP Kevin Zhang says the company plans to open an advanced chip packaging plant in Arizona by 2029 and that construction has begun  —  Taiwan Semiconductor Manufacturing Co (2330.TW) plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters.

Source: TechMeme
Source Link: http://www.techmeme.com/260423/p16#a260423p16