Bloomberg:

Both the US and China see advanced chip packaging, once an afterthought, as a path to higher performance; Intel says the US has just 3% of global capacity  —  The emerging field of advanced packaging is being hailed as an inflection point for the semiconductor industry.  China is moving in on the same arena.

Bloomberg:

Both the US and China see advanced chip packaging, once an afterthought, as a path to higher performance; Intel says the US has just 3% of global capacity  —  The emerging field of advanced packaging is being hailed as an inflection point for the semiconductor industry.  China is moving in on the same arena.

Source: TechMeme
Source Link: http://www.techmeme.com/231121/p16#a231121p16