Yoolim Lee / Bloomberg:

SK Hynix plans to invest over $1B in advanced chip packaging in South Korea, as the company hopes to capture the growing demand for high-bandwidth memory  —  - Korean chipmaker expects AI demand surge to keep growing  — 3D semiconductor expert Lee paved the way for HBM leadership

Yoolim Lee / Bloomberg:

SK Hynix plans to invest over $1B in advanced chip packaging in South Korea, as the company hopes to capture the growing demand for high-bandwidth memory  —  - Korean chipmaker expects AI demand surge to keep growing  — 3D semiconductor expert Lee paved the way for HBM leadership

Source: TechMeme
Source Link: http://www.techmeme.com/240306/p38#a240306p38